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Riyue Guang invested $200 million to attack panel-level fan-out packaging, with trial production at the end of the year
On February 18th, Jinshi Data reported that on February 18th, Wu Tianyu, the chief operating officer of Sun Moon Light Group, stated that the group’s decision to invest in fan-out panel-level packaging (FOPLP) after ten years was an important milestone towards establishing a production line. The resolution is to invest $200 million (about NT$6.4 billion) to establish a production line in Kaohsiung, with equipment installation in the second and third quarters of this year, trial production by the end of this year, and if successful, customer certification will begin next year.