Reply to the First Round Review Inquiry Letter for the IPO Disclosure of Zhongke Kehua Kechuang Board

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2026-03-28 06:57:26

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Beijing Business News (Reporter Ma Huanhuan, Li Jiaxue) On the evening of March 25, the official website of the Shanghai Stock Exchange announced that Jiangsu Zhongke Kehua New Materials Co., Ltd. (hereinafter referred to as “Zhongke Kehua”) has disclosed its first round of audit inquiry response for its Sci-Tech Innovation Board IPO.

It is reported that Zhongke Kehua is a national-level specialized and innovative “little giant” enterprise focused on the research, production, and sales of semiconductor packaging materials, with its main product being epoxy molding compounds. The company’s IPO was accepted on December 5, 2025, and entered the inquiry stage on December 24 of the same year.

In this IPO attempt, Zhongke Kehua aims to raise approximately 598 million yuan, with the net amount after deducting issuance costs to be used for the research and industrialization projects of mid-to-high-end epoxy molding compounds for semiconductor packaging, as well as to supplement working capital.

In the first round of audit inquiry letters, Zhongke Kehua was questioned regarding its products and market competition, core technology, and shareholders.

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