Micron CFO clarifies: HBM4 memory has entered mass production, and overall progress is better than previously expected

NightAirdropper · 2026-02-12T12:47:50+00:00

Micron Chief Financial Officer Mark Murphy stated that the company's HBM4 memory has been mass-produced and is beginning to be shipped to customers, with shipment volumes expected to continue increasing. Micron's HBM product yield meets expectations, and the market demand for memory semiconductors far exceeds supply capacity, leading to a tight situation in the coming years.

NightAirdropper

2026-02-12 12:47:50

Abstract generation in progress

IT Home, February 12 — Micron Technology’s Chief Financial Officer Mark Murphy clarified at the Wolfe Research Automotive, Automotive Technology, and Semiconductors Conference held yesterday local time that the company’s HBM4 memory has entered mass production, and the overall progress is better than previously expected.

Mark Murphy stated that Micron has begun shipping HBM4 memory to customers, and shipment volumes are expected to continue rising this quarter. The company’s HBM capacity is steadily increasing, and all HBM supplies for this calendar year have been sold out. The yield rate of HBM products, including HBM4, meets expectations. Micron’s HBM4 can achieve a transmission speed of 11Gbps, and Micron is confident in its performance, quality, and reliability.

The CFO said that market demand for memory semiconductors far exceeds the supply capacity of the entire industry, including Micron. For some key customers, Micron can only meet 50% to 66% of their demand. Micron expects memory supply to remain tight after 2026. Process upgrade capacity conversion is no longer sufficient to provide additional supply matching demand, and wafer fabrication plant construction takes even longer.

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